Microstructure, thermal behavior, wettability and electrochemical corrosion parameters of Sn₈₂Bi₁₅Zn₃, Sn₇₇Bi₁₅Zn₃Sb₅, Sn₇₉Bi₁₅Zn₃Ag₃ and Sn_81.3Bi₁₅Zn₃Cu_0.7 [Jagadeees1] alloys have been studied and analyzed.  The contact angles of used alloys varied from 21° to 31° which is less than 90° (low contact angle).  That is meant, wetting process of these alloys are very favorable and the fluid will spread over a large area of the surface.  Melting temperature values of Sn₈₂Bi₁₅Zn₃, Sn₇₇Bi₁₅Zn₃Sb₅, Sn₇₉Bi₁₅Zn₃Ag₃ and Sn_81.3Bi₁₅Zn₃Cu_0.7 [Jagadeees2] alloys are lower than tin based eutectic solder alloys, (Sn- Zn or Sn- Cu or Sn- Sb), by 11% to 22%.  Scanning electron microscope, x-ray analysis and differential scanning calorimetry graphs show that, the used alloys contained different phases.  Corrosion rate of Sn₈₂Bi₁₅Zn₃ alloy in HCl varied after adding alloying elements.  Sn₇₇Bi₁₅Zn₃Sb₅ alloy has lowest corrosion rate value.