Pulse Plated Nickel Electrodeposits

DOI : http://dx.doi.org/10.13005/msri/031a05

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Amide-water mixtures with sulfate and acetate have been employed for nickel electrodeposition. Improved physicomechanical properties were related to the presence of amide as cosolvent. Bright, though in some cases highly stressed, deposits were obtained under direct current. Pulse current applications reduced stress and in some cases bright nickel electrodeposits having low stress were obtained. In particular, pulse reverse waveform in millisecond range was found effective. Effects of cathodic or anodic current density, duration of pulse waveform, frequency and temperature on the quality of deposits have been reported. Auger spectra and thermogravimetric analyses of bright nickel deposits revealed pure nickel without inclusion. Support to the brightening theory, where layer of colloidal particles formed near the cathode is captured by a catalytically generated hydrogen film, is thus obtained. A bright nickel foil obtained by dissolving the substrate (brass) proved to be of high strength. This foil was electrodeposited from dimethylformamide-water bath under pulse reverse current waveform.

Pulse Plating; Nickel; Amide-water; stress; bright deposit