Material Science Research India (MSRI) Journal is a open access, peer reviewed international journal, devoted to experimental and theoretical research into the synthesis, structure, properties and applications of materials.     Read more

Frequency : Six monthly, June & December

ISSN: 0973-3469     Online ISSN: 2394-0565

Aims and Scope  Editorial Board

Recent Articles

Structural, Thermal and Optical properties of PMMA, PEO and PMMA/PEO/LiClO4 Polymer Electrolyte Blends

M. Ravindar Reddy 1*, M. Jaipal Reddy 2 and A. R. Subrahmanyam1

Introduction Polymer electrolytes are becoming increasingly important because of their potential use in several electrochemical devices: “smart” windows, displays, sensors, and, more importantly, rechargeable solid-state lithium batteries [1]. Most of the polymer blends are immiscible and shows morphological structure. The morphology of polymer blends change the final properties of polymers. Over the past few decades, polymers like PEO, PMMA, PAN, ... Read More »

Study of Structural Properties of Annealed CdO and ZnO thin films

Kishor Hurde1*  and A. B. Lad2

Introduction CdO and ZnO is an n-type semiconductor belonging to II-VI group of periodic table. These materials possess wide band gap of approximately 2.4eV and 3.3eV at room temperature. These films are semitransparent in nature have been widely used in a flat panel displays, solar cells and gas sensing applications. These films are transparent conducting in nature, inexpensive, mechanically stable ... Read More »

Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys

Abu Bakr El-Bediwi*, Reham Samir and Mustafa Kamal

Introduction Solder is described as fusible alloy with liquidus temperature below 400 °C.  Tin, lead, silver, bismuth, indium, antimony and cadmium are used in solder alloys.  Solders are divided into eutectic and non-eutectic alloys.  Eutectic solder alloys have definite melting temperature but non-eutectic solder alloys have a solidus and liquidus region. Matrix microstructure, elastic modulus, thermal behavior and contact angle ... Read More »